SyscomTech’s Printed Circuit Board Assembly Division manufactures and tests to the highest quality standards for the military, medical, industrial, aerospace, telecommunications, educational, and gaming industries.
Syscom has invested over one million dollars in new equipment in order to achieve the highest quality standard utilizing the latest technology. The difference is monumental. We have increased our capacity by 3X and at the same time lowered our labor costs due to the implementation of fully automated production lines.
See the featured highlights of our new technology that separates us from our competition…
Component Placement as small as 01005
Pick and Place 55,000 components per hour
100% BGA Laser Inspection
Automated Selective Solder Equipment for today’s Mixed Technology
Fully Automated SMT Production Lines
The very latest in Automatic Optical Inspection Technology
The platform we’ve utilized for years is Mydata Automation; an undisputed leader in Flexible SMT placement equipment. Syscom invested in the “Top of the Line” equipment, which utilizes dual gantry technology and is an All-in-One platform.
Our investment wouldn’t be complete if we didn’t add award winning technology by upgrading to the latest Automatic Optical Inspection System. This was a must purchase in order to inspect and test components as small as 01005.
Our equipment page wouldn’t be complete if we didn’t mention the Best in the Class – Selective Soldering Equipment. This equipment allows us to automate production of printed circuit boards designed with mixed technology. Eighty percent of our customer’s boards that have been laid out using surface mount and through hole components, can now be completely manufactured without hand soldering. This process can be accomplished using lead or lead free solder.
Mydata - SMT
Automatic Thermal Adaptation Technology for Unmatched Precision
Active Side Balancing for Maximum Throughput
Intelligent Surface Impact Control
Large Board Capability up to 22.6” x 20”
Agilis Feeder Technology – Servo Controlled with Programmable Acceleration for Maximum Feeder Reliability
G Vision systems including (2) High Resolution Cameras, (2) Standard Resolution Cameras and (2) High Speed LineScan Cameras
On-The-Fly Electrical Verification of Resistors, Capacitors, and Diodes
Automatic Optical Inspection
5 Camera, 5 Megapixel High Resolution Telecentric Optics- Eliminates Perspective and Distortion Errors
Programmable Side Viewing Inspection Technology
Advanced Programmable Lighting with over 350 High Output LED’S
Pre and Post Reflow Capability
Advanced Solder Joint Inspection
Statistical Process Control Software
Laser technology to measure BGA coplanarity; accurate to 5 microns
Selective Soldering Equipment
Programmable Flux Deposition
Programmable Closed Loop Pre-Heat
Programmable Point-to-Point Soldering with High Speed Z Stage
Nitrogen Soldering Environment
Closed Loop Solder Height Control
Pass-Through, In-Line Operation
Process Witness cameras
Convertible to Lead or Lead-Free Smoldering Alloy
Vitronics 830N reflow ovens
High power (350C) heater elements
Imperative to achieve RoHS quality standards.
MPM SPM Screen printers (X3)
Vision stencil alignment.
Glenbrook XR2000 X-Ray inspection
Real time X-ray system.
Allows BGA inspection for positioning, voiding, and solder joint integrity.
PACE TF-2000 BGA Rework Station
Precise removal and installation of BGA components.
Dual vision camera for placement accuracy.
Up to ninety nine individual programmable rework profiles.
Microscopes and Inspection Stations
Vision Engineering Mantis inspection systems (X4).
7X - 40X Zoom microscopes (X4).
Ultrapak Plus Wave Solder
Aqueous Cleaning Systems
Aqueous Technologies Millennium II in line cleaning machine.
Resys closed loop 18 Mega Ohm water filtration system.
Blue M laboratory grade oven.
Circuit Cam Manufacturing based software.
Generates easy to follow color-coded work instructions for each assembly process step.
Import all industry standard ASCII and CAD files for easy extraction of assembly information.
Automated import of bills of materials provided in Excel format.
Automated import of CAD files and bill of materials minimizes defect opportunities.
Logical Devices Chipmaster Programmer
High-speed universal programmer.
Supports thousands of programmable devices
ESD State of the Art Production
Permanent ESD safe epoxy flooring.
Documented daily ESD procedures.
ESD manufactured work stations.
From simple surface mount designs to complex fine-pitch assemblies, from prototype SMT construction to high volume assembly, our state of the art equipment can handle it all. Visit our ISO-certified facility operated by our industry leading manufacturing team. Each of our team members is manufacturer rained and certified.
At Syscom Tech, we work to earn your business every day. Syscom has the capability and experience to meet your exact specifications, every time.
Syscom Tech is ISO 9001:2008 Certified AND QC 080000 IECQ RoHS Certified.
Syscom Tech is proud to announce that we are one of the first Printed Circuit Board Assembly operations in the United States to achieve these two certifications.
Syscom Tech is QC 080000 IECQ HSPM (RoHS) Certified, ISO-9001:2008 Certified, UL-recognized, IPC-610 Certified and IPC-620 Certified. We are also an IPC/WHMA-A-620 certified training center; consider our expertise for your engineering and design needs.
American designed, tested and manufactured! Contact us to find out how Syscom Tech can help you meet your Printed Circuit Board Assembly needs for less…